Ductile grinding is an ideal method for producing a mirror finished surface on hard and brittle materials to significantly decrease polishing time. However, the fused silica is still difficult to ductile grind because of its high brittleness.

Transition between brittle and ductile mode in loose abrasive grinding Donald Golini, Stephen D. Jacobs [1990] Ductile regime grinding of glass and other brittle materials by the use of ultrastiff

Brittle Fracture; There is no appreciable deformation, and crack propagation is very fast. In most brittle materials, crack propagation (by bond breaking) is along specific crystallographic planes (cleavage planes). This type of fracture is transgranular (through grains) producing grainy texture (or faceted texture) when cleavage direction changes from grain to grain.

On the Limit of Surface Integrity of Alumina by DuctileMode Grinding Download » I Zarudi and LC Zhang, Trans ASME, Journal of Engineering Materials and Technology, 122 (2000) 129134. Initiation of dislocation systems in alumina in singlepoint grinding Download »

Ductile regime machining (end milling) of silicon nitride is modelled parametrically to study the effects of various machining parameters such as cutting speed, feed rate and depth of cut on the process.

Ductile Regime Nanomachining ... SiC experiences a ductiletobrittle transition similar to other nominally brittle materials such as silicon, germanium, and silicon nitride. It is believed that the ductility ... by the grinding process used in the production of the wafer.

Effect of cutting edge truncation on ductile DeepDyve. Read "Effect of cutting edge truncation on ductileregime grinding of hard and brittle materials, International Journal of Manufacturing Technology and Management" on ...

surfaces on brittle materials by fast tool servo diamond turning is studied. A machining model has been developed to ensure ductile regime machining of the brittle material, in which the material is removed by both plastic deformation and brittle fracture, but the cracks produced are prevented from being extended into the finished surface.

Wheel Life and CuttingEdge Wear in MirrorGrinding Using a CoarseGrained cBN Wheel Treated by Microdressing ... T. A. Dow, and R. O. Scattergood, "DuctileRegime Grinding of Brittle Materials: Experimental Results and the Development of a Model," Proc. of the SPIE,, pp. 108115, 1988.

tion takes place in the ductile regime, a defectfree nanosurface is possible and it completely eliminates the polishing process. ELID is one of the processes used ... Nano finish grinding of brittle materials using ELID 961 grinding wheel therefore remains constant. This cycle is repeated during the grinding process

ductile regime machining of brittle materials such as semiconductors, ceramics, glasses, etc. to achieve smooth surfaces with ... The possibility of grinding brittle materials in a ductile manner was proposed by King and Tabor [1] (1954), when it was noted that dur

The brittleductile transition in the micro drillgrinding of hard brittle materials was investigated. A ductile regime propelling technology of a resin coating was proposed and successfully developed in this study. This paper demonstrated that this technology could effectively propel the ductileregime of sodalime glass in micro drillgrinding and reduce the fracture size.

When a brittle material needs to be brought to final dimension by hard grinding, it will not exhibit plastic deformation as the diamond grit plows through it to remove material; nor will it exhibit the residual stress profile of a ductile material.

Ductileregime grinding is a new technology made possible by the use of realtime control and precision engineering in the grinding process. By ensuring that the abrasive grinding forces do not exceed a threshold value, it is possible to grind materials that are normally considered "brittle" in such a way that the material removal takes place through plastic deformation rather than fracture.

i PREDICTIVE MODELING FOR DUCTILE MACHINING OF BRITTLE MATERIALS A Dissertation Presented to The Academic Faculty By Sivaramakrishnan Venkatachalam